Introduction
load the application, but since that requires only read-only access, no imposing program is
required. The ROM boot-loaders in some CPUs can check the root directory of a SD card for
a binary in addition to the more usual locations such as external NAND or NOR flash.
1-4 WHY FAT?
File Allocation Table (FAT) is a simple file system, widely supported across major OSs.
While it has been supplanted as the format of hard drives in Windows PCs, removable
media still use FAT because of its wide support. That is suitable for embedded systems,
which would often be challenged to muster the resources for the modern file systems
developed principally for large fixed disks.
μC/FS supports FAT because of the interoperability requirements of removable media,
allowing that a storage medium be removed from an embedded device and connected to a
PC. All variants and extensions are supported to specification.
A notorious weakness of FAT (exacerbated by early Windows system drivers) is its non-fail
safe architecture. Certain operations leave the file system in an inconsistent state, albeit
briefly, which may corrupt the disk or force a disk check upon unexpected power failure.
μC/FS minimizes the problem by ordering modifications wisely. The problem is completely
solved in an optional journaling module which logs information about pending changes so
those can be resumed on start-up after a power failure.
1-5 CHAPTER CONTENTS
Figure 1-1 shows the layout and flow of the book. This diagram should be useful to
understand the relationship between chapters. The first (leftmost) column lists chapters that
should be read in order to understand μC/FS’s structure. The chapters in the second column
give greater detail about the application of μC/FS. Each of the chapters in the third column
examines a storage technology and its device driver. Finally, the fourth column lists the
appendices, the topmost being the μC/FS reference, configuration and porting manuals.
Reference these sections regularly when designing a product using μC/FS.
18
相关PDF资料
AD-UCOS3-SPRD PRD LIC UCOS3 RTOS CORE CCES SGL
AD-UCUSBD-SPRD PRD LIC UCUSB DEV CORE CCES SGL
AD637-EVALZ BOARD EVALUATION FOR AD637
AD736-EVALZ BOARD EVALUATION FOR AD736
AD737-EVALZ BOARD EVALUATION FOR AD737
AD8007AKS-EBZ BOARD EVAL FOR AD8007AKS
AD8018ARU-EVAL BOARD EVAL FOR AD8018
AD8034ART-EBZ BOARD EVAL FOR AD8034ART
相关代理商/技术参数
ADuC-H7020 功能描述:开发板和工具包 - ARM HDR BRD FOR ADUC7020 ARM7 RoHS:否 制造商:Arduino 产品:Development Boards 工具用于评估:ATSAM3X8EA-AU 核心:ARM Cortex M3 接口类型:DAC, ICSP, JTAG, UART, USB 工作电源电压:3.3 V
ADuC-IO7020 功能描述:开发板和工具包 - ARM DEV BRD FOR ADUC7020 ARM7 RoHS:否 制造商:Arduino 产品:Development Boards 工具用于评估:ATSAM3X8EA-AU 核心:ARM Cortex M3 接口类型:DAC, ICSP, JTAG, UART, USB 工作电源电压:3.3 V
ADUCM3027BCBZ-R7 功能描述:LOWPWR CORTEXM3W/128KKEMBEDDED F 制造商:analog devices inc. 系列:* 零件状态:在售 标准包装:1,500
ADUCM3027BCBZ-RL 功能描述:LOWPWR CORTEXM3W/128KKEMBEDDED F 制造商:analog devices inc. 系列:* 零件状态:在售 标准包装:5,000
ADUCM3027BCPZ 功能描述:IC MCU 32BIT 128KB FLASH 64LFCSP 制造商:analog devices inc. 系列:ADuCM 包装:托盘 零件状态:在售 核心处理器:ARM? Cortex?-M3 核心尺寸:32-位 速度:26MHz 连接性:I2C,SPI,UART/USART 外设:DMA,POR,PWM,WDT I/O 数:44 程序存储容量:128KB(128K x 8) 程序存储器类型:闪存 EEPROM 容量:- RAM 容量:96K x 8 电压 - 电源(Vcc/Vdd):1.74 V ~ 3.6 V 数据转换器:A/D 8x12b 振荡器类型:内部 工作温度:-40°C ~ 85°C(TA) 封装/外壳:64-WFQFN 裸露焊盘 供应商器件封装:64-LFCSP(9x9) 标准包装:1
ADUCM3027BCPZ-R7 功能描述:IC MCU 32BIT 128KB FLASH 64LFCSP 制造商:analog devices inc. 系列:ADuCM 包装:剪切带(CT) 零件状态:在售 核心处理器:ARM? Cortex?-M3 核心尺寸:32-位 速度:26MHz 连接性:I2C,SPI,UART/USART 外设:DMA,POR,PWM,WDT I/O 数:44 程序存储容量:128KB(128K x 8) 程序存储器类型:闪存 EEPROM 容量:- RAM 容量:96K x 8 电压 - 电源(Vcc/Vdd):1.74 V ~ 3.6 V 数据转换器:A/D 8x12b 振荡器类型:内部 工作温度:-40°C ~ 85°C(TA) 封装/外壳:64-WFQFN 裸露焊盘 供应商器件封装:64-LFCSP(9x9) 标准包装:1
ADUCM3027BCPZ-RL 功能描述:IC MCU 32BIT 128KB FLASH 64LFCSP 制造商:analog devices inc. 系列:ADuCM 包装:带卷(TR) 零件状态:在售 核心处理器:ARM? Cortex?-M3 核心尺寸:32-位 速度:26MHz 连接性:I2C,SPI,UART/USART 外设:DMA,POR,PWM,WDT I/O 数:44 程序存储容量:128KB(128K x 8) 程序存储器类型:闪存 EEPROM 容量:- RAM 容量:96K x 8 电压 - 电源(Vcc/Vdd):1.74 V ~ 3.6 V 数据转换器:A/D 8x12b 振荡器类型:内部 工作温度:-40°C ~ 85°C(TA) 封装/外壳:64-WFQFN 裸露焊盘 供应商器件封装:64-LFCSP(9x9) 标准包装:2,500
ADUCM3029BCBZ-R7 功能描述:LOWPWR CORTEX M3W/256KEMBEDDED F 制造商:analog devices inc. 系列:* 零件状态:在售 标准包装:1,500